IGBT Module FF300R12KT4

Kollektor-Emitter-Sättigungsspannung Collector-emittersaturationvoltage IC = 300 A, VGE = 15 V IC = 300 A, VGE = 15 V IC = 300 A, VGE = 15 V VCE sat 1,75 2,05 2,10 2,15 V V V Tvj = 25°C Tvj = 125°C Tvj = 150°C Gate-Schwellenspannung Gatethresholdvoltage IC = 11,5 mA, VCE = VGE, Tvj = 25°C VGEth 5,2 5,8 6,4 V Gateladung Gatecharge VGE = -15 V ... +15 V QG 2,40 µC InternerGatewiderstand Internalgateresistor Tvj = 25°C RGint 2,5 Ω Eingangskapazität Inputcapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cies 19,0 nF Rückwirkungskapazität Reversetransfercapacitance f = 1 MHz, Tvj = 25°C, VCE = 25 V, VGE = 0 V Cres 0,81 nF Kollektor-Emitter-Reststrom Collector-emittercut-offcurrent VCE = 1200 V, VGE = 0 V, Tvj = 25°C ICES 5,0 mA Gate-Emitter-Reststrom Gate-emitterleakagecurrent VCE = 0 V, VGE = 20 V, Tvj = 25°C IGES 400 nA Einschaltverzögerungszeit,induktiveLast Turn-ondelaytime,inductiveload IC = 300 A, VCE = 600 V VGE = ±15 V RGon = 1,8 Ω td on 0,16 0,17 0,18 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Anstiegszeit,induktivAnstiegszeit,induktiveLast Risetime,inductiveload IC = 300 A, VCE = 600 V VGE = ±15 V RGon = 1,8 Ω tr 0,04 0,045 0,05 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Abschaltverzögerungszeit,induktiveLast Turn-offdelaytime,inductiveload IC = 300 A, VCE = 600 V VGE = ±15 V RGoff = 1,8 Ω td off 0,45 0,52 0,54 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C Fallzeit,induktiveLast Falltime,inductiveload IC = 300 A, VCE = 600 V VGE = ±15 V RGoff = 1,8 Ω tf 0,10 0,16 0,18 µs µs µs Tvj = 25°C Tvj = 125°C Tvj = 150°C EinschaltverlustenergieproPuls Turn-onenergylossperpulse IC = 300 A, VCE = 600 V, LS = 30 nH VGE = ±15 V, di/dt = 6000 A/µs (Tvj = 150°C) RGon = 1,8 Ω Eon 16,5 25,0 30,0 mJ mJ mJ Tvj = 25°C Tvj = 125°C Tvj = 150°C AbschaltverlustenergieproPuls Turn-offenergylossperpulse IC = 300 A, VCE = 600 V, LS = 30 nH VGE = ±15 V, du/dt = 4500 V/µs (Tvj = 150°C) RGoff = 1,8 Ω Eoff 19,5 29,5 32,5 mJ mJ mJ Tvj = 25°C Tvj = 125°C Tvj = 150°C Kurzschlußverhalten SCdata VGE ≤ 15 V, VCC = 900 V VCEmax = VCES -LsCE ·di/dt ISC tP ≤ 10 µs, Tvj = 125°C 1200 A Wärmewiderstand,ChipbisGehäu

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Shenzhen Hongxinwei Technology Co., Ltd

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Shenzhen Hongxinwei Technology Co., Ltd is located in the Bao’an District of Shenzhen.It is a high-tech enterprise setting research and development, production, sales into an integration. The company covers an area of 15 acres, having modern producing workshop and professional production and testing equipments. The company has an existing staff of more than 100 people.The company has set up offices in Shenzhen, Hongkong and Singapore providing worldwide service.